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UV冷光紫外激光切割机皮秒激光
真正冷加工,基本无炭化;
Completely cold cutting, almost no carbonizing.
效率高,相对纳秒加工,切割速度可以提高数倍;
High effiency,times speed higher than nano laser cutting.
双台面,零上下料时间,题升加工效率;
Easy to use software interface,easy to learn.
加工前预览功能,避免切板报废;
Preview function before processing to avoid damaging sample.
相对于纳秒激光加工,碳化极其微弱;
Carbonization is extremely weak compared to nanosecond laserprocessing.
相对于纳秒加工,速度可提高数倍;
Speed can be increased several times compared to nanosecondprocessing.
加工面更加精细光滑,整齐,干净;
The processing surface is more fine, smooth, tidy and clean;
除了传统的电路板高分子材料和铜箔等加工,皮秒还可以加工,陶瓷,硅片,铁氟龙等材料;
In addition to traditional circuit board polymer materials andcopper foil processing, picoseconds can also be processed,ceramics, silicon wafers, Teflon and other materials;
支持EMCS,MES系统,利用识别二维码自动取舍切割图形单元;
Support EMCS, MES system, use the identification oftwo-dimensional code to automatically select and cut the graphicsunit;