High Thermal Conductivity Plus “S-Class” Softness andConformability
Features and Benefits
• High-thermal conductivity: 5.0 W/m-K
• Highly conformable, “S-Class” softness
• Naturally-inherent tackreduces
interfacial thermal resistance
• Conforms to demanding contoursand
maintains structural integrity withlittle
or no stress applied to fragile
component leads
• Fiberglass reinforced forpuncture,
shear and tear resistance
• Excellent thermal performanceat
low pressures
BERGQUIST GAP PAD TGP 5000 is afiberglass-reinforced filler and polymer featuring a high thermalconductivity. The material yields extremely softcharacteristics while maintaining elasticity andconformability. The fiberglass reinforcement provides easy handlingand converting, added electrical isolation and tear resistance. Theinherent natural tack on both sides assists in application andallows the product to effectively fill air gaps,enhancing theoverall thermal performance.The top side has reduced tack for easeof handling. BERGQUIST GP5000S35 is ideal forhigh-performance applications at low mounting pressures.
BERGQUIST GAP PAD 5000S35 Typical ApplicationsInclude:
• Voltage Regulator Modules (VRMs) and POLs
• CD-ROMs and DVD-ROMs
• PC Board to chassis
• ASICs and DSPs
• Memory packages and modules
• Thermally-enhanced BGAs
Configurations Available:
• Die-cut parts are available in any shape or size, separated orin sheet form