BERGQUIST GAP PAD TGP 1000VOUS Formerly knownas GAP PAD VO Ultra Soft
Ultra-Conformable, Thermally Conductive Material for Filling AirGaps
Features and Benefits
• Thermal conductivity: 1.0 W/m-K
• Highly conformable, low hardness
• “Gel-like” modulus
• Decreased strain
• Puncture-, shear- and tear-resistant
• Electrically isolating
BERGQUIST GAP PAD TGP 1000VOUS is recommendedfor applications that require a minimum amount of pressure oncomponents. The viscoelastic nature of the material alsogives excellent low-stress vibration dampening and shock absorbingcharacteristics. BERGQUIST GAP PAD TGP 1000VOUS is anelectrically isolating material, which allows its use inapplications requiring isolation between heat sinks andhigh-voltage, bare-leaded devices.
BERGQUIST GPVOUS Typical Applications Include:
• Telecommunications
• Computers and peripherals
• Power conversion
• Between heat-generating semiconductors or magnetic componentsand a heat sink
• Areas where heat needs to be transferred to a frame, chassis,or other type of
heat spreader
Configurations Available:
• Sheet form and die-cut parts