深圳松岗回收加工厂电子料 公明收购废料

鸿展电子主打电子废料回收，寻求加工厂与私人老板回收的二手电子废料，价格不是问题，诚意回收，友好交易

鸿展电子回收求购TI ON ST NXP TOSHIBA等集成电路IC,运放IC及光耦,存储器,单片机。

CL05B104KO5NNNC

K4Z80325BC-HC14

CL10A105KP8NNNC

K6T1008C2E-GB70

K8P6415UQB-PI4B

CL21B104KBCNNNC

K4B8G1646Q-MYK0

K9K8G08U0D-SCB0

S3C2440AL-40

KLMAG1JETD-B041

S5PV210AH-A0

CL21B225KAFNNNE

K9K8G08U0A-PCB0

CL21A106KPFNNWE

S3C2416XH-40

KMRH60014A-B614

S4C6410XH-66

K4A8G165WC-BCRC

K4B2G1646F-BYMA

CL21B225KOFNFNE

CL21A106KOQNNNE

CL10A106KP8NNNC

K9F1208U0C-JIB0

K4E8E304ED-EGCC

K4P4G324EQ-RGC2

KMFN10012A-B214

KM8F8001JM-B813

KLMBG4WEBC-B031

K4B1G1646I-BYMA

CL10A106MQ8NNNC

K9K8G08U0D-SIB0

K3RG3G30MM-MGCH

CIL21J1R8KNE

KLMAG2WEPD-B031

CL03A105MQ3CSNC

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LM311

K4B4G1646E-BCMA

K9F2G08UOC-SCB0

CL31B106KOHNNWE

KLM8G1GETF-B041

KLM4G1FEPD-B031

K4B4G1646E-BYMA

S4LJ204X01-Y040

CL21F104ZBCNNNC

S3F8S35XZZ-SO95

K4X51163PK-FGD8

K4G41325FE-HC28

32EMCP24-EL3FTA28

CL10A105KB8NNNC

K9WAG08U1F-SIBO

K4UBE3D4AA-MGCL

KLM4G1FETE-B041

K4W1G1646E-HC12

CL10A475KQ8NNNC

CL10B104KB8NNNC

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S3C2410AL-20

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K4H561638N-LCCC

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CL10A475KO8NNNC

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S3C6410XH-66

S3C2410A-20

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CL21A226MQQNNNE

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UFS128G

KLMAG2GESD-B04Q

K6R4008C1D-JC10

CL03A104MQ3NNNC

K9F1G08U0F-SCB0

K9F4G08U0B-PIBO

CS9012F

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CL21B475KAFNNNE

S3C2416X40-Y640

CL10A105KO8NNNC

KLMBG2JENB-B041

CL10A475MQ8NNNC

K4E6E304EB-EGCG

K9F1G08UOD-SCBO

CL05A105KA5NQNC

CL03C200GA3GNNC

K9F5608R0D-JIB0

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SDP96(PRSS001)

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K4T51163QC-ZCD5

CL03C4R7BAGC

K4AAG165WA-BCWE

CL31B334KBFNNNE

K3MF9F90MM-MGCE

100NF/50V/0805/X7R/CL21B104KBCNNNC

KLM4G1YE4C-B001 original

KLM8G1WE4A-A001

KMF820012M-B305

CL32B106KBJNNWE

S3F9488XZZ-QZ88

K4B1G1646I-BMMA

CL05C620JB5NNC

CIGT252010EH1R0MNE

S5PV210AA0-LA40

K4B4G1646E-BYK0

CL10B104KO8NNNC

K4F6E3S4HM-GFCL

K4A8G165WB-BCPB

KA2206B

CL31A106KAHNNNE

K9GAG08U0E-SCB0

K9F1208U0C-PCB0

CL05A105KQ5NNNC

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K3UH7H70AM-AGCL

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KS8805

A21SC

SQ3U02457D6JFA(24.576MHZ)

CL05B152KB5NNNC

K6T4008C1B-GL55

KA723D

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KA8602B

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CL21B124JACNNNC

KSC1623-GTF

CIG21C4R7MNE

K4S641632N-LC60

K4B2G1646F-BMK0

KMGX6001BM-B514

S3C2410A20-YO80

K4S281632I-UC60

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KA2264

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K4D263238F-QC50

0386A

KMQE60013M-B318

K9F1208U0B-PCB0

K7A803600B-PC16

SWB-M14

K9GAG08UOF-SCBO

K4N56163QF-GC25(16X16 DDR2)

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K6X1008C20-BF55

ICVE21184E070R100

TCPMS0E337MBAR0009

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SH-12A

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SC36410X6F-7040

K4S511632M-TC75

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CL05C101JB5NNNC

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KBE00S00AB-D435

台积电和三星这两大芯片代工商的制程工艺，均已提升到了5nm，更先进的3nm也在按计划推进中，台积电3nm工艺的芯片生产工厂更是已经建成，计划在今年风险试产，明年下半年大规模量产。但产业链方面的消息显示，台积电和三星3nm制程工艺的研发均遇到了挑战，遇到了不同的关键技术瓶颈，研发进度也不得不推迟。

台积电CEO魏哲家此前在财报分析师电话会议上透露的消息显示，他们的3nm工艺仍将采用成熟的鳍式场效应晶体管技术（FinFET）。而三星的3nm工艺则由不同，外媒称他们将采用环绕栅极晶体管技术（GAA）。

目前还不清楚台积电和三星3nm工艺研发过程中遇到的关键瓶颈，会对研发进程造成多大的影响，是否会影响到终的量产时间也还不得而知。

对于台积电的3nm工艺，外媒此前在报道中称他们准备了4波产能，首波产能中的大部分将留给多年的大客户苹果，后三波产能将被高通、英特尔、赛灵思、英伟达、AMD等厂商预订。

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