物理性能：外观、密度、粘度、闪点、沸程、外径、固体含量、吸水率等；
化学性能：酸值、pH 值、铜镜腐蚀性、铜板腐蚀性、水解稳定型、耐油性等；
工艺性能：触变性、助焊性、润湿性、锡槽试验、锡珠试验、喷溅试验等； 电学性能：表面绝缘电阻、电化学迁移、交叉兼容性、体积 /表面电阻率等； 化学成分：金属及非金属元素成分、有机化合物成分、离子成分等；
力学性能：抗拉强度及延伸率、弯曲强度、剪切强度、180°剥离强度等。
Physical property:appearance, density, viscosity, flash point,boiling distance, external diameter, solid content, waterabsorption, etc.
Chemical properties:acid value, PH, corrosion of copper mirror,corrosion of copper plate, stability of hydrolysis and oilresistance.
Process performance:thixotropy, solderability, wettability, tinbath test, tin bead test, splash test, etc. Electricalproperties:surface insulation resistance, electrochemicalmigration, cross compatibility, volume / surface resistivity,etc.
Chemical composition:metallic and non-metallic elements, organiccompounds, ions, etc.
Mechanical property:tensile strength and elongation, bendingstrength, shear strength, peel strength of 180 degree, etc.
