带缓冲垫的四侧引脚扁平封装。QFP封装之一，在封装本体的四个角设置突起（缓冲垫）以防止在运送过程中引脚发生弯曲变形。美国半导体厂家主要在微处理器和ASIC等电路中采用此封装。引脚中心距0.635mm，引脚数从84 到196左右。
11.2 QIC（quad in-line ceramic package）
陶瓷QFP 的别称。部分半导体厂家采用的名称。
MPU-6051M
SRV25-4-T7
MT53E256M32D2DS-053AIT:B
AD8052ARMZ
SCV7538B1
P2S56D40BTP
KLMBG4GE2A-A001
TWL6032A1BBYFFR
SKY77704-4
AD7477ARTZ
AD7999YRJZ-1
ADG419BRMZ
ADG736LBRMZ
MAX1745AUB
MAX5441BEUA
SSM2167-1RMZ
FAN5236QSCX
RT9181CB
AD5160BRJZ100
AD5171BRJZ100
AD5165BUJZ100
AD5235BRUZ25
AD5308ARUZ-REEL7
AD5280BRUZ20
ADP8860ACPZ
RT9801BPE
ADP3331ARTZ
ADR381ARTZ
ADL5315ACPZ
EL7536IYZ-T7
MAX1879EUA+
MAX6138AEXR25+T
LTM4600EV#PBF
A3240ELHLT
AD7740YRTZ
AD7441BRTZ
ADM6823TYRJZ
ADM6823SYRJZ
AD8665ARJZ
ATF-52189
MIC5265-3.0YD5
RT6258BGQUF
ADG608BRUZ
AD8014ARTZ
ADG719BRMZ
ADG819BRMZ
AD7942BCPZ
AD7982BCPZ
ADG419BRZ
AD8029AKSZ-REEL7
AD8591ARTZ
AD8561ARU-REEL
AGB3307S24Q1
AD8651ARMZ
AD8617ARMZ
AD8519AKSZ-REEL7
MAX4490AXK-T
ADP2384ACPZN
CY7C1248KV18-450BZXC
CY7C1264XV18-450BZXC
CY7C1423KV18-300BZXC
CY7C1650KV18-450BZC
CY7C1415KV18-300BZXC
CY7C1418KV18-250BZXC
CY7C1520V18-200BZC
TLC6C598QPWRQ1
VND7140AJTR
AUIRS2191STR
L9347LF-TR
VNH7013XPTR-E
TLE9180D-31QK
TLD2331-3EP
A4916KJPTR-T
S9KEAZN16AMLC
MMPF0100F0ANES
MMPF0100F0AEP
MC13892DJVL
SPC560P44L3CEFAR
SPC5743PK1AMLQ5R
SPC560P50L3CEFAR
IS45S32200L-7BLA2
VNN7NV04PTR-E
VN5E025AJTR-E
NCV2902DTBR2G
TPS74801QRGWRQ1
