PRODUCT DESCRIPTION
A thermally conductive, liquid gap filler material.
Technology
Silicone
Appearance (cured)
Blue
Appearance - Part A
White
Appearance - Part B
Blue
Cure
Room temperature cure or Heat cure
Application
Thermal management,
TIM (Thermal Interface Material)
Mix Ratio by weight:
Part A: Part B
1 : 1
Mix Ratio by volume:
Part A: Part B
1 : 1
Operating Temperature
Range
-60 to 200ºC
FEATURES AND BENEFITS
● Thermal Conductivity: 3.6 W/m-K
● Thixotropic nature makes it easy to dispense
● Two-part formulation for easy storage
● Ultra-conforming, designed for fragile and low-stress
applications
● Ambient and accelerated cure schedules
BERGQUIST GAP FILLER TGF 3600 is a two-component
liquid gap filling material, cured at either room orelevated
temperature, featuring ultra-high thermal performance and
superior softness. Prior to curing, the material maintainsgood
thixotropic characteristics as well as low viscosity.
The result is a gel-like liquid material designed to fill airgaps
and voids yet flow when acted upon by an external force(e.g.
dispensing or assembly process). The material is anexcellent
solution for interfacing fragile components with hightopography
and/or stack-up tolerances to a universal heat sink orhousing.
Once cured, it remains a low modulus elastomer designed to
assist in relieving CTE stresses during thermal cycling yet
maintain enough modulus to prevent pump-out from the
interface. BERGQUIST GAP FILLER TGF 3600 will lightly
adhere to surfaces, thus improving surface area contact.
BERGQUIST GAP FILLER TGF 3600 is not designed to be a
structural adhesive.
TYPICAL APPLICATIONS
● Automotive electronics (HEV, NEV, batteries)
● PCBA to housing
● Discrete components to housing
● Fiber optic telecommunications equipment
TYPICAL PROPERTIES OF UNCURED MATERIAL
Mixed Viscosity, Brookfield - RV, - Helipath, ASTM D2196,
25 °C, mPa·s (cP):
Spindle TF, Speed 20 rpm
150,000
Density, ASTM D792, g/cc
3.0
Pot life @ 25 °C, time for viscosity to double,
minutes
60
Shelf Life @ 25ºC , days
150
TYPICAL CURE SCHEDULE
Cure Schedule
15 hours @ 25°C
30 minutes @ 100°C
Rheometer - time to read 90% cure.
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties
Hardness, Shore 00, Thirty second delay value,
ASTM D2240
35
Flammability, UL 94
V-0
Electrical Properties
Dielectric Strength, ASTM D149, V/mil
275
Dielectric Constant , ASTM D150 @ 1,000 Hz
8.0
Volume Resistivity, ASTM D257, ohm-meter
1×1009
Thermal Properties
Thermal Conductivity, ASTM D5470, W/(m-K)
3.6
GENERAL INFORMATION
For safe handling information on this product, consult theSafety
Data Sheet, (SDS).
Not for product specifications
The technical data contained herein are intended asreference
only. Please contact your local quality department for
assistance and recommendations on specifications for this
product.
The above cure profiles are guideline recommendations. Cure
conditions (time and temperature) may vary based on
customers' experience and their application requirements, as
well as customer curing equipment, oven loading and actual
oven temperatures.
CONFIGURATIONS AVAILABLE
BERGQUIST GAP FILLER TGF 3600 is available in the
following configurations:
● Cartridges
● Kits
STORAGE
Store product in the unopened container in a dry location.
Storage information may be indicated on the productcontainer
labeling.
Optimal Storage: 5 to 25ºC for a 5 month shelf life, insealed
containers with moisture barrier packaging.
Conversions
(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
N x 0.225 = lb/F
N/mm x 5.71 = lb/in
psi x 145 = N/mm²
MPa = N/mm²
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP
Disclaimer
Note:
The information provided in this Technical Data Sheet (TDS)including the
recommendations for use and application of the product are basedon our
knowledge and experience of the product as at the date of thisTDS. The product
can have a variety of different applications as well asdiffering application and
working conditions in your environment that are beyond ourcontrol. Henkel is,
therefore, not liable for the suitability of our product for theproduction processes
and conditions in respect of which you use them, as well as theintended
applications and results. We strongly recommend that you carryout your own
prior trials to confirm such suitability of our product.
Any liability in respect of the information in the TechnicalData Sheet or any other
written or oral recommendation(s) regarding the concernedproduct is excluded,
except if otherwise explicitly agreed and except in relation todeath or personal
injury caused by our negligence and any liability under anyapplicable mandatory
product liability law.
In case products are delivered by Henkel Belgium NV, HenkelElectronic
Materials NV, Henkel Nederland BV, Henkel Technologies FranceSAS and
Henkel France SA please additionally note the following:
In case Henkel would be nevertheless held liable, on whateverlegal ground,
Henkel’s liability will in no event exceed the amount of theconcerned delivery.
In case products are delivered by Henkel Colombiana, S.A.S. thefollowing
disclaimer is applicable:
knowledge and experience of the product as at the date of thisTDS. Henkel is,
product liability law.
In case products are delivered by Henkel Corporation, ResinTechnology
Group, Inc., or Henkel Canada Corporation, the followingdisclaimer is
applicable:
The data contained herein are furnished for information only andare believed to
be reliable. We cannot assume responsibility for the resultsobtained by others
over whose methods we have no control. It is the user'sresponsibility to
determine suitability for the user's purpose of any productionmethods mentioned
herein and to adopt such precautions as may be advisable for theprotection of
property and of persons against any hazards that may be involvedin the handling
and use thereof. In light of the foregoing, HenkelCorporation specifically
disclaims all warranties expressed or implied, includingwarranties of
merchantability or fitness for a particular purpose, arisingfrom sale or use
of
Henkel
Corporation’s
products.
Henkel
Corporation
specifically
disclaims any liability for consequential or incidental damagesof any kind,
including lost profits. The discussion herein of variousprocesses or
compositions is not to be interpreted as representation thatthey are free from
domination of patents owned by others or as a license under anyHenkel
Corporation patents that may cover such processes orcompositions. We
recommend that each prospective user test his proposedapplication before
repetitive use, using this data as a guide. This product may becovered by one or
more United States or foreign patents or patentapplications.
Trademark usage: [Except as otherwise noted] All trademarksin this document
are trademarks and/or registered trademarks of Henkel and itsaffiliates in the
U.S. and elsewhere.
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