BERGQUIST贝格斯 TGF 3600低粘度蓝色导热的液体间隙填充材料

PRODUCT DESCRIPTION

A thermally conductive, liquid gap filler material.

Technology

Silicone

Appearance (cured)

Blue

Appearance - Part A

White

Appearance - Part B

Blue

Cure

Room temperature cure or Heat cure

Application

Thermal management,

TIM (Thermal Interface Material)

Mix Ratio by weight:

Part A: Part B

1 : 1

Mix Ratio by volume:

Part A: Part B

1 : 1

Operating Temperature

Range

-60 to 200ºC

FEATURES AND BENEFITS

● Thermal Conductivity: 3.6 W/m-K

● Thixotropic nature makes it easy to dispense

● Two-part formulation for easy storage

● Ultra-conforming, designed for fragile and low-stress

applications

● Ambient and accelerated cure schedules

BERGQUIST GAP FILLER TGF 3600 is a two-component

liquid gap filling material, cured at either room orelevated

temperature, featuring ultra-high thermal performance and

superior softness. Prior to curing, the material maintainsgood

thixotropic characteristics as well as low viscosity.

The result is a gel-like liquid material designed to fill airgaps

and voids yet flow when acted upon by an external force(e.g.

dispensing or assembly process). The material is anexcellent

solution for interfacing fragile components with hightopography

and/or stack-up tolerances to a universal heat sink orhousing.

Once cured, it remains a low modulus elastomer designed to

assist in relieving CTE stresses during thermal cycling yet

maintain enough modulus to prevent pump-out from the

interface. BERGQUIST GAP FILLER TGF 3600 will lightly

adhere to surfaces, thus improving surface area contact.

BERGQUIST GAP FILLER TGF 3600 is not designed to be a

structural adhesive.

TYPICAL APPLICATIONS

● Automotive electronics (HEV, NEV, batteries)

● PCBA to housing

● Discrete components to housing

● Fiber optic telecommunications equipment

TYPICAL PROPERTIES OF UNCURED MATERIAL

Mixed Viscosity, Brookfield - RV, - Helipath, ASTM D2196,

25 °C, mPa·s (cP):

Spindle TF, Speed 20 rpm

150,000

Density, ASTM D792, g/cc

3.0

Pot life @ 25 °C, time for viscosity to double,

minutes

60

Shelf Life @ 25ºC , days

150

TYPICAL CURE SCHEDULE

Cure Schedule

15 hours @ 25°C

30 minutes @ 100°C

Rheometer - time to read 90% cure.

TYPICAL PROPERTIES OF CURED MATERIAL

Physical Properties

Hardness, Shore 00, Thirty second delay value,

ASTM D2240

35

Flammability, UL 94

V-0

Electrical Properties

Dielectric Strength, ASTM D149, V/mil

275

Dielectric Constant , ASTM D150 @ 1,000 Hz

8.0

Volume Resistivity, ASTM D257, ohm-meter

1×1009

Thermal Properties

Thermal Conductivity, ASTM D5470, W/(m-K)

3.6

GENERAL INFORMATION

For safe handling information on this product, consult theSafety

Data Sheet, (SDS).

Not for product specifications

The technical data contained herein are intended asreference

only. Please contact your local quality department for

assistance and recommendations on specifications for this

product.

The above cure profiles are guideline recommendations. Cure

conditions (time and temperature) may vary based on

customers' experience and their application requirements, as

well as customer curing equipment, oven loading and actual

oven temperatures.

CONFIGURATIONS AVAILABLE

BERGQUIST GAP FILLER TGF 3600 is available in the

following configurations:

● Cartridges

● Kits

STORAGE

Store product in the unopened container in a dry location.

Storage information may be indicated on the productcontainer

labeling.

Optimal Storage: 5 to 25ºC for a 5 month shelf life, insealed

containers with moisture barrier packaging.

Conversions

(°C x 1.8) + 32 = °F

kV/mm x 25.4 = V/mil

mm / 25.4 = inches

N x 0.225 = lb/F

N/mm x 5.71 = lb/in

psi x 145 = N/mm²

MPa = N/mm²

N·m x 8.851 = lb·in

N·m x 0.738 = lb·ft

N·mm x 0.142 = oz·in

mPa·s = cP

Disclaimer

Note:

The information provided in this Technical Data Sheet (TDS)including the

recommendations for use and application of the product are basedon our

knowledge and experience of the product as at the date of thisTDS. The product

can have a variety of different applications as well asdiffering application and

working conditions in your environment that are beyond ourcontrol. Henkel is,

therefore, not liable for the suitability of our product for theproduction processes

and conditions in respect of which you use them, as well as theintended

applications and results. We strongly recommend that you carryout your own

prior trials to confirm such suitability of our product.

Any liability in respect of the information in the TechnicalData Sheet or any other

written or oral recommendation(s) regarding the concernedproduct is excluded,

except if otherwise explicitly agreed and except in relation todeath or personal

injury caused by our negligence and any liability under anyapplicable mandatory

product liability law.

In case products are delivered by Henkel Belgium NV, HenkelElectronic

Materials NV, Henkel Nederland BV, Henkel Technologies FranceSAS and

Henkel France SA please additionally note the following:

In case Henkel would be nevertheless held liable, on whateverlegal ground,

Henkel’s liability will in no event exceed the amount of theconcerned delivery.

In case products are delivered by Henkel Colombiana, S.A.S. thefollowing

disclaimer is applicable:

knowledge and experience of the product as at the date of thisTDS. Henkel is,

product liability law.

In case products are delivered by Henkel Corporation, ResinTechnology

Group, Inc., or Henkel Canada Corporation, the followingdisclaimer is

applicable:

The data contained herein are furnished for information only andare believed to

be reliable. We cannot assume responsibility for the resultsobtained by others

over whose methods we have no control. It is the user'sresponsibility to

determine suitability for the user's purpose of any productionmethods mentioned

herein and to adopt such precautions as may be advisable for theprotection of

property and of persons against any hazards that may be involvedin the handling

and use thereof. In light of the foregoing, HenkelCorporation specifically

disclaims all warranties expressed or implied, includingwarranties of

merchantability or fitness for a particular purpose, arisingfrom sale or use

of

Henkel

Corporation’s

products.

Henkel

Corporation

specifically

disclaims any liability for consequential or incidental damagesof any kind,

including lost profits. The discussion herein of variousprocesses or

compositions is not to be interpreted as representation thatthey are free from

domination of patents owned by others or as a license under anyHenkel

Corporation patents that may cover such processes orcompositions. We

recommend that each prospective user test his proposedapplication before

repetitive use, using this data as a guide. This product may becovered by one or

more United States or foreign patents or patentapplications.

Trademark usage: [Except as otherwise noted] All trademarksin this document

are trademarks and/or registered trademarks of Henkel and itsaffiliates in the

U.S. and elsewhere.

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