IC半导体LED封装检测解决方案WB&DB焊线AOI检测设备
型号：F241/F251
主要特征 ：
1. 可选的5面和6面检查
2. 2.5D深度技术
3. 模块化且灵活
4. 64位操作系统
5. 至强处理器
6. 吞吐量从20,000上升到50,000上升
7. 相机分辨率范围从75 fps时的5百万像素到66fps时的12百万像素
应用范围：
1. 晶圆切割后进行检查以检测表面缺陷。
2. 封装分离后进行检查，以检测封装，标记，引线和电镀缺陷。
TTVISION自动光学检测设备的检测方式
*2D
*2.5D
*True 3D (Z5D)
F251
Wirebond AOI Machine
Features
3D Profiling Technology
Inspects Wire bond, Die & Epoxy Defects
Inspects Gold. Aluminum. Copper and Silver Wires
Measures Ball. Wedge. Stitch and Loop Parameters
Minimum Overkill & Underkill
Modular end Scalable Design
Cost Effective
High Throughput
F241
AOI Standard Configuration
Modular Design for Max Flexibility
Standardized Platform
Common Spare Parts
2D AOI技术规格
·Onload /Offload
Number of Magazines 2-7 units
Substrate Size 30(W) x 150(L) - 200(W) x 300(L)mm
Handling
Camera Indexing High SpeedServo driven XY Gantry
Substrate Indexing Micro-Step Stepperdriven Conveyor
·Inspection Hardware
Camera Resolution 12MP Color
Lighting Multi Channel LED
Optics Low DistortionMacro Lens
Controller PC-based
·Software
Inspection Software TTVISION ©
·Operating System
MS Windows 64 bit OS
·Reject Handling
Electronic Mapping
Defect Classification 99 Categories