将多块半导体裸芯片组装在一块布线基板上的一种封装。根据基板材料可分为MCM-L，MCM-C 和MCM-D 三大类。
MCM-L 是使用通常的玻璃环氧树脂多层印刷基板的组件。布线密度不怎么高，成本较低。
MP2229GQ-Z
MP2560DN-LF-Z
MP3120DJ-LF-Z
MP3423GG-Z
MP3426DL-LF-Z
MP6211DN-LF-Z
SY6281AAC
MA730GQ-Z
MP1494SGJ-Z
MP1496DJ-LF-Z
MP1601GTF-Z
MP1652GTF-Z
MP2305DS-LF-Z
MP2617BGL-Z
SY8703ABC
SY7301AADC
OB3396AP
SY7310AADC
SY5018BFAC
SY5830BABC
SY5839ABC
SY5867FAC
MCP2551T-I/SN
TJA1057GT/3
TJA1042T/1J
DPA424R-TL
PCA82C251T/YM
NRF52811-QCAA-R
PN5321A3HN/C106
SYH407AAC
APW8720BKAE-TRG
M74HC4040RM13TR
TJA1041T/CM
MC74ACT125DR2G
AD5694RBCPZ-RL7
TLV4112IDGNR
DS2417P+TR
MAX211IDWR
STM32L151CBT6
STM32F030C8T6
STM32F207VCT6
STM32F051C8T6
STM32L052K8U6TR
STM32P100R8SODTR
STM32P100R8S0DTR
STM32P10SODTR
STM32P10S0DTR
STM32F103R6H6
STM32L151R8H6
74VHC595MTCX
YDA174-QZE2
TJA1042T/CM
XC4VSX55-11FF1148I
XC4VSX55-10FF1148I
M25P64-VMF6TP
AT24C64D-SSHM-T
KMK7X000VM-B314
PIC18F25K80-I/SS
HCS300-I/SN
IRF7317TRPBF
CM108B
IRFB7537PBF
ATTINY45-20SU
LAN9514-JXZ
MCP3201-BI/SN
