2025电子元器件展|2025深圳国际电子元器件展览会「官网」
展览时间：2025年4月9-11日
展会时间：2025年4月9日-11日
论坛时间：2025年4月9日-11日
展地点：深圳国际博览中心
展会规模：50,000平方米、800家展商、90,000名观众
J-STD-001《Requirements for SolderedElectrical and Electronic Assemblies》
J-STD-002《Solderability Tests for Component Leads, Terminations, Lugs, Terminalsand Wires》
J-STD-004 《Requirememt for SolderingFlux》
- J-STD-020 《Moisture/ReflowSensitivity Classification of Plastic Surface
JESD22-B106-D Resistance to SolderShock for Through-Hole Mounted Devices
JESD97《Marking, Symbols,and Labels for Identification of Lead(Pb) FreeAssemblies, Components and Devices》
IPC-1066《Marking, Symbols, andLabels for Identification ofLead Free and Other Reportable Materials inLead Free Assemblies, Components and Devices》
IPC-SM-786《Procedures forCharacterizing and Handling of Moisture/ReflowSensitive PlasticICs》
IPC-SM-780 《Guidelines for ComponentPackaging and Interconnection with Emphasison SurfaceMounting》
IPC-SC-60《Post Solder SolventCleaning Handbook 》
IPC-AC-62 《Post Solder AqueousCleaning Handbook 》
IPC-CH-65 《Guidelines for Cleaningof Printed Boards and Assemblies 》
IPC-7711 《Reworkof ElectronicAssemblies(Replaces IPC-R-700) 》
IPC-7721 《Repairand Modification ofPrinted Boards and Electronic Assemblies(ReplacesIPC-R-700)》